Thermal Management Solutions for High-Density Computing

Advanced heatsinks and high heat-flux liquid cold plates engineered to manage extreme thermal loads at chip and system level.

Thermal Solutions for Compact Consumer Electronics

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High Heat-Flux Liquid Cold Plates

High-performance liquid cold plates remove heat directly from high-power chips, enabling efficient hotspot control and thermal stability in extreme heat-flux computing environments.
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A CPU heat sink with copper heat pipes and aluminum cooling fins.

Micro-Structured Liquid Cold Plates

Optimized internal flow structures maximize heat transfer efficiency, supporting direct-to-chip cooling and consistent thermal performance under continuous high-load operation.
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High-density silver aluminum skived fin heat sink on a dark background.

High-Density Skived Fin Heatsinks

Skived fin heatsinks provide maximum surface area in compact volumes, supporting auxiliary cooling where air-cooled solutions are still required around computing modules.
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An assortment of silver and black aluminum extruded heat sinks in various sizes and fin configurations, arranged on a dark grey surface.

Bonded-Fin Heatsinks for Power Regulation Modules

Bonded-fin heatsinks handle rising power density in VRMs and supporting electronics, balancing thermal efficiency, mechanical strength, and production stability.
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An assortment of silver and black aluminum extruded heat sinks in various sizes and fin configurations, arranged on a dark grey surface.

Heat Pipe Assisted Heatsinks

Heat pipe heatsinks rapidly spread localized heat from concentrated sources, improving temperature uniformity and reducing thermal stress across critical components.
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A variety of silver and black aluminum extruded heat sinks arranged on a dark grey surface.

Integrated Structural Thermal Components

Structural components with thermal functions combine mechanical support and heat dissipation, reducing interfaces and improving overall system-level thermal reliability.
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Why Data Centers Choose Our Cooling Solutions

Engineered capabilities focused on chip-level cooling, hotspot control, and long-term thermal stability under extreme heat flux.

  • GPU cooling plate

    • Cold plate material: Aluminum alloy
    • Cold plate process: Skived fin + brazed integrated design
    • Cold plate connection method: GPU cold plates in a 2-series, 4-parallel configuration
    • TDP: GPU 700W*8; Switch: 135W*4
    • Quick-connect fitting: Staubli SPT10
    • Connection method: EPDM braided hose
    • Product status: DVT

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  • Liquid cooling system

    Cold plate material: Copper C1100
    Cold plate process: Skived fin + brazed integrated + embedded tube cold plate
    Cold plate type: CPU cold plate + DIMM + HDD cold plate + several expansion cards
    TDP: Ptotal approximately 3000W
    Quick-connect fitting: Parker NSG03
    Connection method: EPDM braided hose + copper tubing
    Product status: DVT

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  • 4080 graphics card air cooling module

    Cold plate material: Copper C1100
    Cold plate process: Skived fin + brazed integrated + embedded tube cold plate
    Cold plate type: CPU cold plate + DIMM + HDD cold plate + several expansion cards
    TDP: Ptotal approximately 3000W
    Quick-connect fitting: Parker NSG03
    Connection method: EPDM braided hose + copper tubing
    Product status: DVT

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Customer Testimonials

Trusted in High-Performance & High-Density Systems

“The cooling solution maintained stable performance under sustained high computational loads.”

Dr. Alan Xu
High-Performance Computing Systems

“The ability to design and manufacture high heat-flux cold plates was key for our project. Jiujutech demonstrated strong engineering depth and manufacturing consistency.”

Michael Zhang
Advanced Computing Equipment Manufacturer

“Process control and repeatability were essential for our long-term program. Jiujutech’s production capability gave us confidence to scale.”

Kevin Liu
High-Density Power Systems

Why Choose Us

A Thermal Manufacturing Partner for Advanced Computing Systems

  • Proven experience in high heat-flux thermal product development

  • Strong R&D capability in liquid cold plate design and manufacturing

  • Precision manufacturing for complex internal structures

  • Stable production supporting long-term, high-performance platforms

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High-Heat-Flux Thermal Solutions in Real Applications

FAQs

Yes. Our cooling solutions are designed to handle high heat flux and are suitable for modern high-performance computing platforms.

We provide both air-cooled and liquid-cooled solutions, including cold plates for high-density computing environments.

All solutions are designed and validated for 24/7 operation with long-term reliability as a core requirement.

Yes. We develop customized designs based on server layout, power levels, and integration requirements.

By optimizing thermal paths and heat transfer efficiency, our solutions reduce cooling energy demand at the system level.

Get in touch with us

Tell us your project requirements and receive a tailored quote from our engineering team.
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